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Silicon Refinement and monocrystalization #3

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Hiiragi283 opened this issue Jun 28, 2024 · 0 comments

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engineering enhancement

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Hiiragi283 commented Jun 28, 2024

SiO2 + C -> Si + CO2
Si + 2Cl2 -> SiCl4
SiCl4 + 2x H2 -> Si (refined) + 4x HCl
CZ/チョクラルスキー法で単結晶化
単結晶を切ってウェハに

表面の研磨
表面の酸化

薄膜形成

フォトレジスト：感光材を塗る

パターン形成

エッチング
レジスト剥離
ドーパント注入：酸化膜のない部分に不純物イオンを注入する
平坦化
電極形成

ダイシング
ワイヤーボンディング：金属枠にチップを固定し金線でつなぐ
モールディング：樹脂でパッケージ

参考文献

SEMI, イラストで分かる半導体製造工程, https://www.semijapanwfd.org/manufacturing_process.html

Hiiragi283 added enhancement engineering labels

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